Translate from English into Russian:

A widely used approach is to use composites of polymer and fillers. When the fillers were added in polymer, the heat could be conducted through the fillers (usually have high thermal conductivity) instead of the polymer, which can significantly improve the thermal conductivity of the composite. The thermal conductivity of the particles, the loading level, the shape and size of the particle, the particle dispersion and orientation, the interface status and other factors would have a significant effect on thermal conductivity of the composite.

Polymers

The common polymers used in electrical engineering are epoxy (Epoxy), silicone rubber, polyimide (PI), polypropylene (PP), low density PE (LDPE), HDPE and other new modified polymers. As the matrix of the composites, the polymer should have the following properties: excellent insulating, mechanical and moulding properties; relatively low thermal expansion coefficient and low dielectric constant; high filling fraction of inorganic particles; and cheap and variety of sources.

Thermal conductivity of the composite depends on the number of heat conduction paths and interfacial thermal resistance. If the amount of the added inorganic particles is small, even the particles can be uniformly dispersed in the matrix, the increase of thermal conductivity is not obvious because there is no full contact between the particles thus heat will also be transferred by the matrix. With the further addition of the inorganic particles, when the filling amount exceeds a certain threshold, the heat could be conducted by the particles and then the thermal conductivity of the composite system will increase rapidly.

To form the heat conduction path in the matrix is critical for improving the thermal conductivity. The kind, shape, size, surface modification and distribution of the particle would have great effect on forming the paths.